硬件高级仿真工程师-智能驾驶

到岗时间：不限 婚况要求：不限 General Job Purpose：工作职责概述：Responsible for the before and after simulation of the project design phase, responsible for the PCB PI SI EMC simulation analysis and provide PCB design optimization suggestions based Ｏn the simulation results.Proficiency with PCB design process, able to review PCB design based Ｏn experience.Experience in thermal simulation is best。负责项目设计阶段的前后仿真，负责PCB板级PI SI EMC仿真分析，根据仿真结果提供PCB设计优化建议。熟悉PCB设计流程，能够根据经验Review PCB设计。有热仿真经验***。Main Job Responsibilities：主要工作职责：1.Pre-simulation support can be carried out at the early stage of project development (before PCB design) 项目开发初期（PCB设计之前）可以进行前仿真支持2.Proficiency with time domain and frequency domain simulation, provide PI DDR PCIE Ethernet and high-speed Signal simulation in the PCB Layout, perform EMC simulation Ｏn sensitive parts of the PCB, support PCB design, and output related simulation reports. 熟悉时域以及频域仿真，在PCB设计阶段提供PI DDR PCIE Ethernet等电源以及高速线仿真，对PCB敏感部分进行EMC仿真，支持PCB设计，输出相关仿真报告。3.Review PCB deign 审查PCB设计4.Have thermal simulation experience, need to support project thermal simulation and output reports. 如有热仿真经验，则需支持项目热仿真并输出报告。Required Qualifications：任职资格：1. 所需学历/学位 Degree：Bachelor/Master 本科/硕士 所需专业 Major：electronic engineering 电子工程相关2. 至少3年相关工作经验 At least 3 years of relevant working experiences3. 所需专业知识和技能 Required Professional Knowledge and Skills * DDR 、PCIE 、Ethernet 、LVDS、等高速模块规范，PI 相关理论（SOC POC） * 高频电磁理论（EMC等） * Ansys软件操作（Q3D、Siwave、HFSS） * High-Speed Signal PCB layout experience4. 所需软技能 Required Soft Skills * Communication 沟通 * Coordination 协调 * Customer First 客户导向 * Innovation 创新 * Proactive 积极主动5. 其他要求 Other Requirements * English 英语 CET-4 * Proficiency with Ansys electromagnetic related kits (Q3D, Siwave, HFSS) 熟练使用Ansys电磁相关套件（Q3D、Siwave、HFSS) * Proficiency with Cadence related software 熟悉Cadence相关软件 * Proficiency with thermal simulation software (such as Icepak) is better 熟悉热仿真软件（如Icepak）更佳